Morning Overview on MSN

This new 3D chip could smash AI’s biggest bottleneck

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the ...
Morning Overview on MSN

This new 3D chip could smash the 'memory wall' slowing AI

Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...

This New 3D Chip Could Shatter the “Memory Wall” Holding Back AI

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...
Tech Xplore on MSN

First monolithic 3D chip built in U.S. foundry delivers major AI speed gains

A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring and order-of-magnitude speed gains.
Electronics For You

AI Hardware Gets A 3D Upgrade

Can a 3D chip change AI forever? It can move data faster, uses less energy, and packs more power in less space. Find out more ...
Electronic Design

Siemens’ Xpedition Substrate Integrator provides co-design prototyping and planning of 2.5/3D chips.

Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...
Science Daily

This new 3D chip could break AI’s biggest bottleneck

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...