Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...
Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...
Morning Overview on MSN
This new 3D chip could smash the 'memory wall' slowing AI
Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...
A new power supply technology for 3D-integrated chips has been developed using a vertically stacked architecture, where processing units are positioned directly above dynamic random access memory ...
Researchers have demonstrated the first chip-based 3D printer, a tiny device that emits reconfigurable beams of visible light into a well of resin that rapidly cures into a solid shape. The advance ...
A new technical paper titled “3D integration of pixel readout chips using Through-Silicon-Vias” was published by researchers at CERN, IZM Fraunhofer and University of Geneva. “Particle tracking and ...
BBCube™: Bumpless Build Cube. A bumpless three-dimensional semiconductor integrating technology can address the challenges posed by traditional system-in-package (SiP) approaches. A novel power ...
Siemens’ Xpedition Substrate Integrator provides co-design prototyping and planning of 2.5/3D chips.
Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...
Morning Overview on MSN
This new 3D chip could smash AI’s biggest bottleneck
Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the ...
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