Deep Reactive Ion Etch Equipment Market Expands Rapidly as Chipmakers Prioritize Yield Optimization and Process Precision | Valuates Reports

The Global Semiconductor Etch Equipment Market revenue was USD 22730 Million in 2022 and is forecast to a readjusted size of USD 49330 Million by 2029 with a CAGR of 11.2% during the forecast period ...
AZOM

Deep Reactive Ion Etching — PlasmaPro 100 Estrelas DRIE

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Tech Xplore on MSN

Joint research validates new semiconductor etching process, achieving five times speed improvement

A collaborative research team from Nagoya University and Tokyo Electron Miyagi Ltd. has demonstrated that the company's new ...
Semiconductor Engineering

Cryogenic Etch: A Key Enabler Of 3D NAND

Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...
Machine Design

Dual-mode plasma etching system - Plasma Etch

The PE-100 Convertible plasma system incorporates reactive ion etching and isotropic etching/cleaning technologies into a stand-alone benchtop system. The all aluminum chamber has over 240 in. 2 of ...
Semiconductor Engineering

Measurement Of Deep Trenches To Study The RIE Lag Effect

The demand for accurate characterization of high aspect ratio geometries such as narrow gaps, deep trenches or deep holes arises in many technologies and industries. A variety of metrology techniques ...
EDN

Applied offers deep-trench silicon etch chamber for sub-100-nm DRAM processes

SANTA CLARA, Calif.–Applied Materials Inc. today announced a new silicon etch chamber for 200- and 300-mm wafer DRAM fabs needing deep-trench etching technology for 100-nm and below process geometries ...
AppleInsider

iPad Pro with OLED may be more expensive because of dry etching

There are a few methods in dry etching, such as isotropic radial etching, reactive ion etching, sputter etching, and ion milling. The intricacies of each are beyond the scope of this article, and ...
AZOM

How to Measure RIE Lag in Deep Trenches Using 3D Optical Profiling

Accurately characterizing high aspect ratio geometries—such as narrow gaps, deep trenches, and deep holes—is becoming increasingly important across a wide range of technologies and industries. To meet ...