HiTek Power and e2v technologies (e2v) have announced a collaborative program to develop a range of highly efficient, power-factor corrected high-voltage power supplies for use in inductive output ...
New product provides the Space RF engineering and design community with an off-the-shelf high frequency RF switch for the most challenging high-reliability space applications. MILPITAS, ...
MILPITAS, Calif.--(BUSINESS WIRE)--Teledyne e2v HiRel, part of the Teledyne Defense Electronics Group, today announced the latest addition to its rapidly expanding line of RF solutions, a new RF MMIC ...
Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced that it will be offering High Reliability qualified versions of California-based Integra ...
TOKYO, JAPAN--(Marketwired - Sep 3, 2013) - e2v, the innovative solutions provider, will be showcasing its new RF Safe-Stop™ technology, with the ability to stop vehicle engines at a distance of up to ...
New VCOs give Space RF designers high frequency off-the-shelf ceramic options for challenging high-reliability space applications MILPITAS, Calif., June 12, 2023--(BUSINESS WIRE)--Teledyne e2v HiRel ...
TOKYO--(Marketwired - Aug 12, 2013) - e2v aerospace and defense, Inc. (e2v a&d), a leader in RF power, imaging, and hi-rel semiconductor solutions, recently announced a life extension program for ...
Essex RF and microwave specialist E2v Technologies has been chosen to develop superconducting RF power couplers for the European X-ray free electron laser (XFEL) programme. The technically challenging ...
Teledyne e2v HiRel today announced availability of a new single-pole, double-throw multi-chip module (MCM) switch with world class power handling. The surface mount PIN-diode hybrid exhibits superior ...
Teledyne e2v is developing a fully radiation-tolerant (RT) space computing reference design, enabling high-speed data routing in space applications. Based on an Arm Cortex-A72, and with multiple ...
How and why f max hit a wall at the 28-nm node. Progress in RF signal-chain innovation will come not on ASICs but on FPGAs. Developments in direct data-conversion devices will pave the way to SDM air ...
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