Samsung, SK hynix, and Micron are fighting each other over new 16-Hi HBM memory, as NVIDIA requests the new 16-Hi HBM memory ...
The Chosun Ilbo on MSN
Hanmi Semiconductor leads HBM TC bonder market with 71.2% share
South Korea, which leads the global HBM (high-bandwidth memory) market, has also captured approximately 90% of the global market share in semiconductor equipment. According to TechInsights’ *2025 HBM ...
TL;DR: SK hynix has completed the re-purposing of its M10F semiconductor fab in Icheon, South Korea, converting DRAM packaging lines to HBM packaging lines. This expansion increases HBM production ...
HANMI Semiconductor ranked No. 1 in market share for high bandwidth memory (HBM) TC bonders in the third quarter of this year, according to a survey. According to the "2025 TC bonder market report for ...
Micron Technology is reportedly planning to invest JPY1.5 trillion(US$9.6 billion) to establish a new high-bandwidth memory (HBM) manufacturing facility at its ...
High-bandwidth memory stands at the forefront of multiple technology developments as a critical enabler of AI, but it is one of the most difficult modules to manufacture. Leading HBM device makers and ...
Despite a 22% drop in the last six months, I remain bullish on Applied Materials due to strong AI-driven DRAM demand. The AI era's rapid expansion is supercharging DRAM needs, positioning AMAT well ...
Nvidia has reportedly begun testing the limits of the global AI memory supply chain by signaling interest in 16-layer ...
Selling Micron Technologies in the current environment isn't sensible due to its strong US manufacturing footprint and competitive HBM product offering amidst higher tariff concerns. Micron benefits ...
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