Power integrity for today’s designs requires accurate modeling of voltage variation across die and efficient coupling between chip/package layouts in a unified platform. March 12th, 2015 - By: Chris ...

SANTA CLARA, Calif. – July 22, 2009 – Sigrity, Inc., known for its signal and power integrity solutions for ICs, packages and printed circuit boards, today unveiled a new version of its XtractIM ...

SAN JOSE, Calif.-- January 31, 2011--Apache Design Solutions, providing the industry’s leading power and noise solutions for Chip-Package-System (CPS) convergence from RTL to sign-off, announced the ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...

Version 2.0b of AEi Systems’ Power IC Model Library for the Cadence PSpice simulator is now available from EMA Design Automation. Version 2.0b contains over 200 time-domain simulation models for power ...

Packing more IC functionality into smaller form factors stacks the deck against IC makers and foreshadows difficult interconnect challenges. How much can one package take? As consumer electronics ...