Kinsus Interconnect Technology, a unit of Pegatron, challenged market fears of a looming IC substrate shortage, arguing supply of both ABF and BT substrates still exceeds demand. Only high-layer ABF ...

Zhen Ding Technology made its debut at SEMICON Taiwan 2024, where the company highlighted the expanding role of IC substrates in advanced semiconductor manufacturing. At the 3D IC/CoWoS for AI forum ...

SEOUL, South Korea, Dec. 22, 2025 /PRNewswire/ -- LG Innotek (CEO Moon Hyuksoo) announced on December 22 that the company has successfully developed a 'Next-Generation Smart IC (integrated circuit) ...

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The "The Global Market for Glass Substrates for Semiconductors 2026-2036" report has been added to ResearchAndMarkets.com's offering. The Global Glass Substrate for Semiconductors Market 2026-2036 ...

The Orbotech Corus™ DI platform provides a fully automated and extendable solution for highly accurate and efficient patterning processes "PCB and IC substrate manufacturers are helping electronic ...

It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...

Big Fund Phase III has not made direct investments in semiconductor companies, deploying capital through affiliated ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

Cuts carbon dioxide emissions from its production by 50%—equivalent to planting 1.3 million trees annually. Boosts durability by up to three times for secure information recognition even with ...