There is much confusion regarding how to make meaningful design decisions when converting a datasheet’s thermal resistance parameters. This introductory article will help today’s hardware engineers ...

In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...

As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often ...

This document is a product information of the ACS711, a 3 mm x 3 mm micro-sized packaged linear current sensor IC. This fully integrated device has a primary conductor resistance of only 0.6 mΩ which ...