ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...
The German tooling firm announces the development of a new texturing process for multicrystalline wafers using diamond wire sawing on its LINEX inline system. Company believes process can boost multi ...
Researchers from China's Shandong University have proposed a new methodology for the quantitative prediction of excess kerf loss caused by lateral vibration of diamond wire wafer cutting in solar ...
Leading PV manufacturing equipment supplier Meyer Burger Technology said it had been awarded new tool orders from two existing customers in Europe and Asia valued at CHF15 million (US$15.3 million).
Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...
LONDON--(BUSINESS WIRE)--According to the latest market study released by Technavio, the global semiconductor silicon wafer market is expected to reach USD 8.32 billion by 2021. This research report ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback