The types of devices being deployed in cars and how they differ in functionality. Why each device type requires a different test technique. Determining the best approach for the specific application.

As we approach the physical limits of semiconductors, new technologies are required to develop advanced chips. New materials, device types and more efficient architectures and packaging are necessary ...

[This is a sponsored article with Selangor Information Technology & Digital Economy Corporation (Sidec).] For decades, Malaysia has played a crucial role in the global semiconductor industry, ...

Advantest had a phenomenal and historic FY 2022, growing revenues 34% and EPS 55%. Mirroring the decline in the semiconductor industry, it forecasted 14% lower revenue growth for FY2023. Poor guidance ...

Guadalajara plan expands ASE’s global footprint, increases presence in North America The future establishment of a semiconductor packaging and test facility in Jalisco paves the way for the ...

Easily and accurately measure dynamic characteristics on a Wide-Bandgap power semiconductor bare chip without soldering or probe needles Keysight fixture enables quick, repeated test without damaging ...

From development through high volume manufacturing (HVM), semiconductor manufacturers’ pain points change based on the life stages. Each stage requires different types of applications to help with ...

Back when semiconductor devices contained only a few thousand gates, manufacturing test was almost an afterthought. The development team threw the chip “over the wall” to the test engineers, who ...

Advantest's reported earnings deteriorated for the first two quarters of FY23, with earnings for the first half of the FY down 60%. The stock market has not followed the decline in earnings because it ...

NORTH READING, Mass.--(BUSINESS WIRE)--Teradyne, Inc. (NASDAQ: TER) today announced that Shannon Poulin has joined Teradyne to succeed Rick Burns as President of the Semiconductor Test Division in Q2 ...

King Yuan Electronics Co (KYEC), one of the world's largest testing and packaging services firms, is set to exit China citing issues arising from US sanctions on semiconductors. In a statement on its ...