FREMONT, Calif., Jan. 25, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

During lapping, a spinning abrasive surface is used to thin wafers from the backside. As the process progresses, precise feedback is required to monitor the amount of material removed and determine ...

ACM’s Ultra C VI Tool Supports Most Semiconductor Clean Processes for Advanced Logic, DRAM and 3D NAND Manufacturing; Provides 50% More Throughput Than 12 Chamber Tool FREMONT, Calif., April 21, 2022 ...

RTP is a semiconductor manufacturing technique in which silicon wafers are heated at temperatures above 1000 o C using lasers or high-intensity lamps for a few seconds. During the cooling of the ...

Stanford spin-out says it can halve the cost of semiconductor wafers on which high-efficiency power electronics are made. Halo Industries, a California-based startup company with a novel, laser-based, ...

In this article, the most common errors occurring at different stages of the semiconductor fabrication process and the strategies to mitigate them are discussed. The ever-growing complexity of the ...