Trikon Technologies and Eco-Snow Systems have developed a sputtering technique for producing GaAs and other compound semiconductor devices The process has the potential to increase productivity for ...
At the beginning of my career in semiconductor equipment, the backside of the wafer was a source of anxiety. In one memorable instance in my early career, several wafers flew off a robot blade during ...
SAN JOSE –KLA-Tencor Corp. today said it is the first company to supply a fully automated system for inspection of wafer backsides during the production of 0.13-micron ICs on 300-mm silicon substrates ...
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