Abstract: An advanced quantum processor requires millions of qubits but is at present limited in scalability due to limitations in the wiring of qubits. A 2.5D silicon (Si) interposer provides an ...

Abstract: Chiplet-based packaging technology integrates multiple heterogeneous dies with different functions and materials into a single system as a LEGO-based approach using advanced packaging ...

Interposers and bridges, two of the key elements for interconnecting multiple chips and chiplets in an advanced package, are undergoing fundamental changes in how they’re built and assembled.

Rapidus, Japan's state-backed chipmaker, has developed a prototype glass interposer for artificial intelligence chips. The company says the technology could lower production costs and strengthen its ...